RTD Embedded Technologies, Inc. specializes in the design and manufacturing of rugged, turnkey PC/104 systems qualified for the most demanding applications. RTD’s rugged HighRel systems include IDAN® (Intelligent Data Acquisition Node), HiDAN® and HiDANplus® (High Reliability Intelligent Data Acquisition Nodes). Each system is built using frames milled from solid aluminum blocks to exacting specifications ensuring that the solution is rugged and reliable. By following the proven PC/104 stackable standards, RTD’s rugged box enclosures guarantee modularity and reconfigurability. Frames for thermally sensitive components have internally milled heat sinks and specialized thermal transport technology to move heat to the outside walls of the enclosure allowing operation from –40 to +85°C without the use of active cooling. Optional shock-mount bases withstand specific shock and vibration requirements.

IDAN^®
IDAN (Intelligent Data Acquisition Node) is the only industry standard PC/104 packaging method that maintains PC/104’s modularity, and enables reconfiguration without the costly chore of rewiring or board redesign. IDAN packaging expands the simple but rugged stacking concept of the PC/104 architecture to the enclosure. This rugged enclosure packaging system is a solution for any of RTD's PC/104, PC/104-Plus, PCI-104, PCI/104-Express and PCIe/104 modules.

Each board is mounted in its own frame and all I/O connections are accessible on the outside of the frame using standard PC-type connectors. No internal board-to-board connections are made other than through the stackable PC/104 ISA bus, PC/104-Plus PCI bus, and PCIe/104 PCI Express bus. This system allows any module to be easily removed or changed. Expanding the functionality of an IDAN system is as easy as adding another module to the stack. IDAN systems include an external, clear chromate coating. A variety of MIL-SPEC paint and shock-mount isolation options are available.
 

HiDAN^®
RTD's HiDAN (High Reliability Intelligent Data Acquisition Node) is an excellent solution when conditions demand a system capable of performing in harsh environments. HiDAN’s design maximizes ruggedization by enhancing resistance to shock, vibration, water, and airborne particles. Just like the IDAN system, each frame is milled from a solid block of T-6061 aluminum. HiDAN systems also include an integrated tongue and groove O-ring for environmental sealing and EMI suppression, ensuring a watertight system with minimum emissions. The machined aluminum frames coupled with MIL I/O connectors add superior shock and impact resistance to your system. A variety of MIL-SPEC paint and shock-mount isolation options are available.


 

HiDANplus^®
RTD developed HiDANplus (High Reliability Intelligent Data Acquisition Node Plus) to provide a top-of-the-line enclosure solution for computer modules based on the PC/104 architecture. HiDANplus combines the modular stacking concept of IDAN with the environmental ruggedness of HiDAN. Each HiDANplus frame has an integrated tongue and groove O-ring for environmental sealing and EMI suppression, ensuring a watertight system with minimum emissions. Like HiDAN, HiDANplus enclosures are milled from a solid, impact-resistant aluminum alloy, and can be configured with user-specified PC connectors or military cylindrical connectors.

Each HiDANplus frame contains one to four PC/104 boards and I/O connectors. In addition to the stackable ISA, PCI, and PCI Express busses, added module-to-module signal connections are achieved using an internal stackable signal raceway. The raceway allows user-configurable I/O connectors to be mounted on any frame in the system; this eliminates restrictive frame-to-frame wiring harnesses. Expanding, maintaining, or upgrading the functionality of a HiDANplus system is as easy as adding or removing frame slices in the stack. As with IDAN and HiDAN, a variety of MIL-SPEC paint and shock-mount isolation options are available.
 

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