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An AS9100 and ISO 9001 Certified Company

PCI Express to PCI Bridge Modules

Operating Temperature -40° to +85°C

BRG2110AHR for STACK-UP configurations BRG2110BHR for STACK-DOWN configurations
BRG2110AHR (side view) BRG2110BHR (side view)
Rugged IDAN configuration Available

Key Features

  • Uses a PCI Express (PCIe) x1 link to interface to CPU module
  • Provides a full PCI Interface with power (+5V, +3.3V, +12V) to PCI-104 and PC104-Plus Peripheral Cards

PCI Express Bus

  • Provides 2.5 Gbps in each direction
  • Single lane and single Virtual Channel operation
    • Compatible with multi-Virtual Channel chipsets
  • Packetized serial traffic with PCI Express Split Completion protocol
  • Data Link Layer Cyclic Redundancy Check (CRC) generator and checker
  • Automatic Retry of bad packets
  • In-band interrupts and messages
  • Message Signaled Interrupt (MSI) support


  • 32-bit, 33 MHz PCI Bus
  • PCI Master Controller allows PCI Express access to PCI Target Devices
  • PCI Target Controller allows full transparent access to PCI Express resources
  • Message Signaled Interrupt (MSI) support
  • Four Bus Masters
  • Jumper selectable VIO
    • 5V or 3.3V signal level
  • Jumper selectable -12V @ 500 mA power supply to PCI bus


  • Does not require any software or drivers

Physical Attributes

  • Dimensions
    • Length (L): 3.775 inches (95.89 mm)
    • Width (W): 3.550 inches (90.17 mm)
    • Stand-off Height: 0.600 inches (15.24 mm)
  • Weight: Approximately 0.12 lbs. (55 g)
  • Standard Operating Temperature, 90% humidity non-condensing: -40 to +85°C
  • Storage Temperature: -40 to +85°C
  • MTBF: 5,621,401 hours
  • Power Consumption: 0.5 W at 5 VDC typical

Documentation and Downloads

Ordering Information

Part Number Description Value
BRG2110AHR   PCIe to PCI bridge for above the CPU


BRG2110BHR   PCIe to PCI bridge for below the CPU



RTD Embedded Technologies, Inc.
Designed and Made in the USA
sales@rtd.com   |   +1-814-234-8087