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An AS9100 and ISO 9001 Certified Company

Stackable Packaging System for BRG2110 Bridge Modules

-40° to +85°C Operation

IDAN-BRG2110AHRS (front) for stacking ABOVE the CPU
IDAN-BRG2110BHRS (front) for stacking BELOW the CPU

Key Features

  • PCI Express Expansion Bus
  • PCI Expansion Bus
  • Modular rugged milled aluminum frames
  • Maintains the PC/104 bus self-stacking concept
  • Allows quick interchangeability of modules
  • Each frame includes BRG2110 bridge module, wiring and connectors
  • Aluminum Alloy - 6061, Temper-T6
  • Finish - MIL-PRF-85285 polyurethane topcoat, per FED-STD-595, color 36495 (light gray). Panel engravings per FED-STD-595, color 37038 (black).
    • Additional paint options available upon request

External I/O Ports

  • There are no external I/O connectors on IDAN-BRG2110 frames

Physical Attributes

  • Dimensions:
    • Length: 5.983 inches (152 mm)
    • Width: 5.117 inches (130 mm)
    • Height: 0.669 inches (17 mm)
  • Weight: Approximately 0.46 lbs. (0.21 Kg)
  • Operating Temperature: -40 to +85°C, 90% humidity non-condensing
  • Storage Temperature: -55 to +125°C

Board-Level Specifications

Documentation and Downloads

Ordering Information

Part Number Description Value
IDAN-BRG2110AHRS   PCIe to PCI Bridge for Above the CPU in modular IDAN frame


IDAN-BRG2110BHRS   PCIe to PCI Bridge for Below the CPU in modular IDAN frame



RTD Embedded Technologies, Inc.
Designed and Made in the USA
[email protected]   |   +1-814-234-8087