PCIe/104 Embedded DSP Controllers
Texas Instruments TMS320C667x™ 1.25 GHz Multi-Core DSPs
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Description
Based on the Texas Instruments TMS320C667x, RTD’s SPM35CP dspModules are versatile fixed/floating point embedded DSP controllers with a PCIe/104 stackable bus structure. The onboard DSP chip supports high-performance signal processing applications such as imaging, test, and automation. Deterministic processing allows the DSP to outperform general purpose processors for time-critical applications. The C6678 platform is power-efficient and easy to use. The C66x CorePac DSP is fully backward compatible with TI’s existing C6000 family of fixed and floating point DSPs.
High-speed data connections such as PCI Express, Serial RapidIO®, and Gigabit Ethernet connect the DSP to the outside world. The PCI Express connector permits the DSP to act as a co-processor to a PCIe/104 host cpuModule while 16 Mbyte of onboard flash permits true stand-alone operation of the DSP without a host. A high-speed multifunction interface enables system‑level peer‑to‑peer data transfer. Additional hardware features include one RS-232/422/485 serial port as well as fourteen 5V-tolerant 3VTTL digital I/O.
When paired with an RTD cpuModule and a high-speed signal source/drain (e.g. RTD’s DM35418HR dataModule), the result is a complete high-speed data acquisition, signal processing, and decision-making system. The Gigabit Ethernet connections, or stackable Serial RapidIO® (which boasts four configurable lanes), are ideal for high-speed data transfers between the DSP and the mated data acquisition board or system.
The SPM35CP is available in dual-core and octal-core configurations and includes a suite of matching host-side and DSP-side libraries permitting single and multi-threaded applications for all on-board features.
Key Features
- PC/104 form factor
- PCIe/104 stackable bus structure
- PCIe universal expansion bus (Type 1 or Type 2)
- PCIe x1 interface (Gen 2, 5 GT/s)
- Compatible with RTD's Intel Core i7-based cpuModules
- Available in stackable, rugged enclosures
- Texas Instruments TMS320C667x™ DSP Core Subsystems (C66x CorePacs)
- Built for real-time, deterministic processing
- 1.25 GHz C66x Fixed/Floating-Point CPU Core
- Dual-core (C6672) and Octal-core (C6678) options
- 32 KByte Level 1 Program (L1P) cache per core
- 32 KByte Level 2 Data (L2D) cache per core
- 512 KByte Local Level 2 cache per core
- 4096 KByte On-chip RAM
- 2GB or 4GB DDR3 SDRAM (surface-mounted)
- 64 bit / 1300 MHz operation
- Surface-mounted for maximum reliability
- Features robust Error Code Correction (ECC)
- 16 Mbyte SPI Flash for user bootloaders
- Power connector and onboard flash permit stand-alone boot-mode without a CPU
- Requires only +5V VDC for operation
- Differential synchronous SyncBus
- Allows multiple RTD boards to share a common clock
- Allows the DSP to synchronize sampling of DAQ cards
- SyncBus between boards can be connected via cable or through an on-board stacking connector
- SPI bus with four chip selects
- Four Serial RapidIO® ports
- Up to 5 GT/s operation per lane
- Supports Direct I/O, Message Passing
- Link configurations configurable as four x1, two x2, one x4, and two x1 + one x2
- Gigabit Ethernet
- Supports 10/100/1000 Mb/s operation
- Single controller with two switched connections
- One Serial Port (RS-232/422/485)
- Configurable as:
- RS-232 port with TxD, RxD, CTS, and RTS
- RS-422/485 port with TxD+, TxD-, RxD+, RxD-
- 120 ohm termination for RS-422/485 Mode
- Standard PC 16C550 UART Interface
- 14 single-ended 3VTTL digital I/O
- 5V tolerant
- 5V, 0.5A supply current for external user hardware
- JTAG emulator connector
- Compatible with TI JTAG Emulators (e.g. XDS100v2)
- Allows for program loading and low-level debugging
- Additional Hardware Features
- Status LED
- Reset Button Input
- Rotary switch selectable boot mode
- -40 to +85°C standard operating temperature
- Heat Sink Options
- Thermal-optimized mini-fan heat sink included (standard)
- Modified heat sinks and flat heat spreaders are available
- Passive Structural Heat Sink & Heatpipes in IDAN and HiDAN System Configurations
Connector Interface
- Stackable Buses
- PCIe universal expansion bus (156-pin, 22 mm stack height)
- Multifunction Interface (104-pin, 22 mm stack height)
- External I/O Connectors
- 16-pin header: LVDS SyncBus (see ordering options)
- 14-pin right-angle header: TI JTAG
- Two 10-pin right-angle headers: Gigabit Ethernet
- 10-pin right-angle header: Serial port
- 16-pin right-angle header: GPIO
- 10-pin right-angle header: Utility
- 12-pin right-angle header: +5V Auxiliary Power
Software Features
- DSP Platform Library provides routines for low-level DSP hardware initialization
- Network Development Kit (NDK) for Ethernet communication
- Boot Loader for standalone operation (boot from flash)
- Linux software for communication and control of DSP from a cpuModule
- Example program to demonstrate DMA from RTD's DM34216HR to the SPM3xCP
- Note: TI Code Composer Studio required for DSP software development
Recommended Accessories
Physical Attributes
- Dimensions
- Length (L): 3.775 inches (95.89 mm)
- Width (W): 3.550 inches (90.17 mm)
- Stand-off Height
- Above the CPU: 0.866 inches (22.00 mm)
- Below the CPU: 0.600 inches (15.24 mm)
- Weight: Approximately 0.40 lb (0.18 kg)
- Standard Operating Temperature, 90% humidity non-condensing: -40 to +85°C
- Storage Temperature: -55 to +125°C
- MTBF for all models (excludes fan): 1,288,071 hours
- Input Power Requirements: +5 VDC
- Power Consumption
- DSP power consumption is heavily influenced by the running software and system activity.
- Typical Power Consumption:
- SPM35CPD1250HR-2048 (dual-core, 2GB SDRAM): 7.0 W
- SPM35CPD1250HR-4096 (dual-core 4GB SDRAM): 9.5 W
- SPM35CPE1250HR-2048 (octal-core, 2GB SDRAM): 10.0 W
- SPM35CPE1250HR-4096 (octal-core, 4GB SDRAM): 12.5 W
- Please refer to the hardware manual for detailed consumption scenarios.
- Typical Power Consumption:
Documentation and Downloads
Ordering Information
Part Number | Description | Cores | SDRAM | Value OEM |
---|---|---|---|---|
SPM35CPD1250HR‑2048 | PCIe/104 Dual-Core DSP Module with right‑angle SyncBus header | 2 | 2GB | $2545 |
SPM35CPD1250HR‑2048‑SS | PCIe/104 Dual-Core DSP Module with stack‑through SyncBus header | 2 | 2GB | $2545 |
SPM35CPD1250HR‑2048‑SNS | PCIe/104 Dual-Core DSP Module with non‑stackthrough SyncBus header | 2 | 2GB | $2545 |
SPM35CPD1250HR‑4096 | PCIe/104 Dual-Core DSP Module with right‑angle SyncBus header | 2 | 4GB | $2745 |
SPM35CPD1250HR‑4096‑SS | PCIe/104 Dual-Core DSP Module with stack‑through SyncBus header | 2 | 4GB | $2745 |
SPM35CPD1250HR‑4096‑SNS | PCIe/104 Dual-Core DSP Module with non‑stackthrough SyncBus header | 2 | 4GB | $2745 |
SPM35CPE1250HR‑2048 | PCIe/104 Octal-Core DSP Module with right‑angle SyncBus header | 8 | 2GB | $2775 |
SPM35CPE1250HR‑2048‑SS | PCIe/104 Octal-Core DSP Module with stack‑through SyncBus header | 8 | 2GB | $2775 |
SPM35CPE1250HR‑2048‑SNS | PCIe/104 Octal-Core DSP Module with non‑stackthrough SyncBus header | 8 | 2GB | $2775 |
SPM35CPE1250HR‑4096 | PCIe/104 Octal-Core DSP Module with right‑angle SyncBus header | 8 | 4GB | $2975 |
SPM35CPE1250HR‑4096‑SS | PCIe/104 Octal-Core DSP Module with stack‑through SyncBus header | 8 | 4GB | $2975 |
SPM35CPE1250HR‑4096‑SNS | PCIe/104 Octal-Core DSP Module with non‑stackthrough SyncBus header | 8 | 4GB | $2975 |
RTD Embedded Technologies, Inc.
Designed and Made in the USA
[email protected] | +1-814-234-8087